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Vacuum sealing techniques.
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ISBN: 1563962594 Year: 1994 Publisher: New York (N.Y.) Springer

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Lead-free electronics : iNEMI projects lead to successful manufacturing
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ISBN: 9780471448877 9780470171479 0470171472 1281032484 9786611032487 0470171464 Year: 2007 Publisher: Hoboken, N. J. : [Piscataqay, New Jersey] : Wiley, IEEE Xplore,

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Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timely???most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.

Reflow soldering processes
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ISBN: 0750672188 9780750672184 9786611006679 128100667X 008049224X 9780080492247 Year: 2002 Publisher: Boston Newnes

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Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.Written using a very practica

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies.
Authors: ---
ISBN: 0070366489 Year: 1997 Publisher: New York (N.Y.) McGraw-Hill

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