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Steam-boilers. --- Tubes --- Deterioration.
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Steam-boilers. --- Tubes --- Deterioration.
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Tubes --- Steam-boilers --- Pressurized water reactors --- Defects. --- Deterioration.
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Tubes --- Steam-boilers --- Pressurized water reactors --- Defects. --- Deterioration. --- Deterioration.
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1. Stirring, general 2. Stirrer power 3. Homogenization 4. Gas-liquid contacting 5. Suspension of solids in liquids (S/L system) 6. Dispersion in L/L systems 7. Intensification of heat transfer by stirring 8. Mixing and stirring in pipes
Mengen. --- Mengtechnieken. --- Procestechnologie. --- Mixing. --- Contacting apparatus --- Dispersion (of materials) --- Homogenization --- Pipes tubes --- Stirring --- Suspensions (physical chemistry)
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Electric circuits --- Electronic circuits --- 621.3'7 --- Electron-tube circuits --- Electron tubes --- Electronics --- Circuits, Electric --- Electric lines --- Electrical engineering--?'7 --- 621.3'7 Electrical engineering--?'7
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This book gives a comprehensive review of the present status of research in this fast moving field by researchers actively contributing to the advances. After a short introduction and a brief review of the relation between carbon nanotubes, graphite and other forms of carbon, the synthesis techniques and growth mechanisms for carbon nanotubes are described. This is followed by reviews on nanotube electronic structure, electrical, optical, and mechanical properties, nanotube imaging and spectroscopy, and nanotube applications.
Carbon. --- Nanostructured materials. --- Tubes. --- Carbone --- Nanomatériaux --- Tubes --- Carbon --- Nanostructured materials --- Tubing --- Tubular goods --- Shells (Engineering) --- Nanomaterials --- Nanometer materials --- Nanophase materials --- Nanostructure controlled materials --- Nanostructure materials --- Ultra-fine microstructure materials --- Microstructure --- Nanotechnology --- Group 14 elements --- Light elements --- Nanotechnology. --- Surfaces (Physics). --- Characterization and Evaluation of Materials. --- Physics --- Surface chemistry --- Surfaces (Technology) --- Molecular technology --- Nanoscale technology --- High technology --- Materials science. --- Material science --- Physical sciences
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Enteral feeding --- Parenteral feeding --- Enteral Nutrition. --- Parenteral Nutrition. --- Enteral feeding. --- Parenteral feeding. --- Intravenous Feeding --- Nutrition, Parenteral --- Parenteral Feeding --- Feeding, Intravenous --- Feeding, Parenteral --- Feedings, Intravenous --- Feedings, Parenteral --- Intravenous Feedings --- Parenteral Feedings --- Intravenous feeding --- Parenteral hyperalimentation --- Parenteral nutrition --- Total parenteral nutrition --- Enteral hyperalimentation --- Hyperalimentation, Enteral --- Gastric Feeding Tubes --- Enteral Feeding --- Force Feeding --- Nutrition, Enteral --- Tube Feeding --- Feeding Tube, Gastric --- Feeding Tubes, Gastric --- Feeding, Enteral --- Feeding, Force --- Feeding, Tube --- Feedings, Force --- Force Feedings --- Gastric Feeding Tube --- Tube, Gastric Feeding --- Tubes, Gastric Feeding --- Parenteral Nutrition Solutions --- Artificial feeding --- Nutrition --- Parenteral therapy
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This book focuses on a specific engineering problem that is and will continue to be important in the forth-coming information age: namely, the need for highly integrated radio systems that can be embedded in wireless devices for various applications, including portable mobile multimedia wireless communications, wireless appliances, digital cellular, and digital cordless. Traditionally, the design of radio IC’s involves a team of engineers trained in a wide range of fields that include networking, communication systems, radio propagation, digital/analog circuits, RF circuits, and process technology. However as radio IC’s become more integrated, the need for a diverse skill set and knowledge becomes essential for professionals as well as students to broaden beyond their trained area of expertise and to become proficient in related areas. The key to designing an optimized, economical solution for radio systems on a chip hinges on the designer’s thorough understanding of the complex trade-offs from communication systems down to circuits. To acquire the insight and understanding of the complex system and circuit trade-offs, a designer must digest volumes of books covering diverse topics, such as communications theory, radio propagation, and digital/analog/RF circuits. While books are available today that cover the individual areas, they tend to be narrowly focused and do not provide the necessary insight in the specific problem of integrating a complete radio system on a chip.
Wireless communication systems --- Digital integrated circuits. --- Radio --- Equipment and supplies. --- Transmitter-receivers. --- Systems engineering. --- Computer engineering. --- Circuits and Systems. --- Electrical Engineering. --- Electronic circuits. --- Electrical engineering. --- Electric engineering --- Engineering --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics
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With the exponential growth of the number of Internet nodes, the volume of the data transported on the backbone has increased with the same trend. The load of the global Internet backbone will soon increase to tens of terabits per second. This indicates that the backbone bandwidth requirements will increase by a factor of 50 to 100 every seven years. Transportation of such high volumes of data requires suitable media with low loss and high bandwidth. Among the available transmission media, optical fibers achieve the best performance in terms of loss and bandwidth. High-speed data can be transported over hundreds of kilometers of single-mode fiber without significant loss in signal integrity. These fibers progressively benefit from reduction of cost and improvement of perf- mance. Meanwhile, the electronic interfaces used in an optical network are not capable of exploiting the ultimate bandwidth of the fiber, limiting the throughput of the network. Different solutions at both the system and the circuit levels have been proposed to increase the data rate of the backbone. System-level solutions are based on the utilization of wave-division multiplexing (WDM), using different colors of light to transmit s- eral sequences simultaneously. In parallel with that, a great deal of effort has been put into increasing the operating rate of the electronic transceivers using highly-developed fabrication processes and novel c- cuit techniques.
Optical detectors. --- Metal oxide semiconductors, Complementary. --- Integrated circuits. --- Systems engineering. --- Computer engineering. --- Circuits and Systems. --- Electrical Engineering. --- Electronic circuits. --- Electrical engineering. --- Electric engineering --- Engineering --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics
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