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Plastic product material and process selection handbook
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ISBN: 9781856174312 185617431X 9780080514055 0080514057 1281755036 9781281755032 9786611755034 Year: 2004 Publisher: Kidlington, Oxford, UK New York, USA Elsevier

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This book is for people involved in working with plastic material and plastic fabricating processes. The information and data in this book are provided as a comparative guide to help in understanding the performance of plastics and in making the decisions that must be made when developing a logical approach to fabricating plastic products to meet performance requirements at the lowest costs. It is formatted to allow for easy reader access and this care has been translated into the individual chapter constructions and index. This book makes very clear the behaviour of the 35,000 different p

Systems approach to engineering design
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ISBN: 158053774X 9781580537742 9781580534796 1580534791 Year: 2004 Publisher: Boston : [Piscataqay, New Jersey] : Artech House, IEEE Xplore,

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Until now systems engineering methods have been the exclusive domain of large organizations employing hundreds of engineers to develop and deliver complex, tightly integrated systems designs. This book offers you a thorough and practical introduction to using systems engineering for managing your systems design projects. It empowers you with proven techniques that help you lead a small design team to world-class performance levels.

Engineering design reliability handbook.
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ISBN: 0849311802 Year: 2004 Publisher: Boca Raton CRC


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Mechanical design
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ISBN: 0750657715 9780080473420 0080473423 9780750657716 6611002871 9786611002879 9781281002877 1281002879 Year: 2004 Publisher: Oxford : Butterworth-Heinemann,

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This book introduces the subject of total design, and introduces the design and selection of various common mechanical engineering components and machine elements. These provide ""building blocks"", with which the engineer can practice his or her art.The approach adopted for defining design follows that developed by the SEED (Sharing Experience in Engineering Design) programme where design is viewed as ""the total activity necessary to provide a product or process to meet a market need."" Within this framework the book concentrates on developing detailed mechanical design skills in the

Engineering by design
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ISBN: 0131409190 Year: 2004 Publisher: Upper Saddle River, N.J. ; London : Pearson/Prentice Hall,

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Engineering By Design introduces students to a broad range of important design topics. The engineering design process provides the skeletal structure for the text, around which is wrapped numerous cases that illustrate both successes and failures in engineering design. The text provides a balance of qualitative presentation of engineering practices that can be understood by students with little technical knowledge and a more quantitative approach in which substantive analytical techniques are used to develop and evaluate proposed engineering solutions. This flexibility means that the text can be used in a wide variety of courses. [Publisher]

Retooling manufacturing : bridging design, materials, and production
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ISBN: 1280175931 9786610175932 0309533414 9780309533416 0309092663 9780309092661 0309182255 Year: 2004 Publisher: Washington, DC : National Academies Press,

Fracture and fatigue emanating from stress concentrators
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ISBN: 9781402016097 1402016093 9781402026126 1402026129 Year: 2004 Publisher: New York : Kluwer Academic Publishers,

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A vast majority of failures emanate from stress concentrators such as geometrical discontinuities. The role of stress concentration was first highlighted by Inglis (1912) who gives a stress concentration factor for an elliptical defect, and later by Neuber (1936). With the progress in computing, it is now possible to compute the real stress distribution at a notch tip. This distribution is not simple, but looks like pseudo-singularity as in principle the power dependence with distance remains. This distribution is governed by the notch stress intensity factor which is the basis of Notch Fracture Mechanics. Notch Fracture Mechanics is associated with the volumetric method which postulates that fracture requires a physical volume. Since fatigue also needs a physical process volume, Notch Fracture Mechanics can easily be extended to fatigue emanating from a stress concentration.

Verilog : frequently asked questions : language, applications and extensions
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ISBN: 0387228993 0387228349 Year: 2004 Publisher: New York, New York : Springer,

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The Verilog Hardware Description Language was first introduced in 1984. Over the 20 year history of Verilog, every Verilog engineer has developed his own personal “bag of tricks” for coding with Verilog. These tricks enable modeling or verifying designs more easily and more accurately. Developing this bag of tricks is often based on years of trial and error. Through experience, engineers learn that one specific coding style works best in some circumstances, while in another situation, a different coding style is best. As with any high-level language, Verilog often provides engineers several ways to accomplish a specific task. Wouldn’t it be wonderful if an engineer first learning Verilog could start with another engineer’s bag of tricks, without having to go through years of trial and error to decide which style is best for which circumstance? That is where this book becomes an invaluable resource. The book presents dozens of Verilog tricks of the trade on how to best use the Verilog HDL for modeling designs at various level of abstraction, and for writing test benches to verify designs. The book not only shows the correct ways of using Verilog for different situations, it also presents alternate styles, and discusses the pros and cons of these styles.

Low-power deep sub-micron CMOS logic : sub-threshold current reduction
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ISBN: 1402028482 1402028490 1475710577 9781402028496 9781402028489 Year: 2004 Volume: 841 Publisher: Boston (Mass.) : Kluwer academic,

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1. 1 Power-dissipation trends in CMOS circuits Shrinking device geometry, growing chip area and increased data-processing speed performance are technological trends in the integrated circuit industry to enlarge chip functionality. Already in 1965 Gordon Moore predicted that the total number of devices on a chip would double every year until the 1970s and every 24 months in the 1980s. This prediction is widely known as "Moore's Law" and eventually culminated in the Semiconductor Industry Association (SIA) technology road map [1]. The SIA road map has been a guide for the in­ dustry leading them to continued wafer and die size growth, increased transistor density and operating frequencies, and defect density reduction. To mention a few numbers; the die size increased 7% per year, the smallest feature sizes decreased 30% and the operating frequencies doubled every two years. As a consequence of these trends both the number of transistors and the power dissi­ pation per unit area increase. In the near future the maximum power dissipation per unit area will be reached. Down-scaling of the supply voltage is not only the most effective way to reduce power dissipation in general it also is a necessary precondition to ensure device reliability by reducing electrical fields and device temperature, to prevent device degradation. A draw-back of this solution is an increased signal propa­ gation delay, which results in a lower data-processing speed performance.

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