Narrow your search

Library

KU Leuven (3)

ULiège (3)

Odisee (2)

Thomas More Kempen (2)

Thomas More Mechelen (2)

UCLL (2)

ULB (2)

VIVES (2)

UGent (1)


Resource type

book (3)


Language

English (3)


Year
From To Submit

2015 (3)

Listing 1 - 3 of 3
Sort by

Book
2015 International 3D Systems Integration Conference (3DIC 2015) : Sendai, Japan, 31 August - 2 September 2015
Author:
ISBN: 146739386X 1467393851 Year: 2015 Publisher: Piscataway, NJ : IEEE,

Loading...
Export citation

Choose an application

Bookmark

Abstract

Annotation The IEEE 3DIC 2015 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications.


Book
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Authors: --- ---
ISBN: 9783319076119 3319076108 9783319076102 1322136785 3319076116 Year: 2015 Publisher: Cham : Springer International Publishing : Imprint: Springer,

Loading...
Export citation

Choose an application

Bookmark

Abstract

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects.  Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis, and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor,  and inductive-based communication system, and bandpass filtering. ·Introduces a robust model that captures accurately all the loss modes of a TSV,  coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region; ·Enables readers to use a model which is technology dependent and can be used for any TSV configuration; ·Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors; ·Equips readers for fast parasitic extraction of TSVs for 3D IC design.


Book
More than Moore Technologies for Next Generation Computer Design
Author:
ISBN: 9781493921638 1493921622 9781493921621 1493921630 Year: 2015 Publisher: New York, NY : Springer New York : Imprint: Springer,

Loading...
Export citation

Choose an application

Bookmark

Abstract

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance.  Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”.  Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

Keywords

Engineering. --- Circuits and Systems. --- Electronics and Microelectronics, Instrumentation. --- Processor Architectures. --- Computer science. --- Electronics. --- Systems engineering. --- Ingénierie --- Informatique --- Electronique --- Ingénierie des systèmes --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Three-dimensional integrated circuits --- Integrated circuits --- Photonics. --- Nanotechnology. --- Multichip modules (Microelectronics) --- Computer engineering. --- Design and construction. --- Computers --- MCM (Microelectronics) --- Multi-chip modules (Microelectronics) --- Multichip integrated circuits --- Multichip microcircuits --- Multichip packages (Microelectronics) --- Multichip units (Microelectronics) --- Molecular technology --- Nanoscale technology --- New optics --- 3D ICs (Three-dimensional integrated circuits) --- Design and construction --- Microprocessors. --- Microelectronics. --- Electronic circuits. --- Microelectronic packaging --- High technology --- Optics --- Informatics --- Science --- Electrical engineering --- Physical sciences --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Minicomputers --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electron-tube circuits --- Electric circuits --- Electron tubes

Listing 1 - 3 of 3
Sort by