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This book deals with the EM analysis of closed microwave cavities based on a three-dimensional FDTD method. The EM analysis is carried out for (i) rectangular microwave ovens and (ii) hybrid-cylindrical microwave autoclaves at 2.45 GHz. The field distribution is first estimated inside domestic rectangular ovens in xy-, yz-, and zx-plane. Further, the RF leakage from the oven door is determined to study the effect of leakage radiation on wireless communication at 2.45 GHz. Furthermore, the EM analysis of the autoclave is carried out based on 3D FDTD using staircase approximation. In order to show the capability of autoclaves (excited with five source) for curing the aerospace components and materials, the field distribution inside autoclave cavity is studied in presence of aerospace samples. The FDTD based modelling of oven and autoclave are explained with the appropriate expressions and illustrations.

Microwaves. --- Optical engineering. --- Electrical engineering. --- Lasers. --- Photonics. --- Microwaves, RF and Optical Engineering. --- Communications Engineering, Networks. --- Optics, Lasers, Photonics, Optical Devices.

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Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Electronics. --- Microelectronics. --- Microwaves. --- Optical engineering. --- Electronic circuits. --- Electronics and Microelectronics, Instrumentation. --- Microwaves, RF and Optical Engineering. --- Circuits and Systems.

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This book presents an in-depth treatment of routing and wavelength assignment for optical networks, and focuses specifically on quality-of-service and fault resiliency issues. It reports on novel approaches for the development of routing and wavelength assignment schemes for fault-resilient optical networks, which improve their performance in terms of signal quality, call blocking, congestion level and reliability, without a substantial increase in network setup cost. The book first presents a solution for reducing the effect of the wavelength continuity constraint during the routing and wavelength assignment phase. Further, it reports on an approach allowing the incorporation of a traffic grooming mechanism with routing and wavelength assignment to enhance the effective channel utilization of a given capacity optical network using fewer electrical-optical-electrical conversions. As a third step, it addresses a quality of service provision scheme for wavelength-division multiplexing (WDM)-based optical networks. Lastly, the book describes the inclusion of a tree-based fault resilience scheme in priority-based dispersion-reduced wavelength assignment schemes for the purpose of improving network reliability, while maintaining a better utilization of network resources. Mainly intended for graduate students and researchers, the book provides them with extensive information on both fundamental and advanced technologies for routing and wavelength assignment in optical networks. The topics covered will also be of interest to network planners and designers.

Microwaves. --- Optical engineering. --- Electrical engineering. --- Computer communication systems. --- Microwaves, RF and Optical Engineering. --- Communications Engineering, Networks. --- Computer Communication Networks.

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Im Zentrum des Bandes steht die Herleitung der Maxwell'schen Gleichungen und deren Lösung. Die Stationen auf diesem Weg sind die Gesetze des Strömungsfeldes, der Elektrostatik und Magnetostatik. Der Band richtet sich an Studenten der Elektrotechnik und Informationstechnologie und an Studenten des Faches Physik mit dem Ziel, ihnen den Einstieg in die Vorlesung Elektromagnetische Feldtheorie zu erleichtern. Der Band baut auf den Kenntnissen auf, die in den Leistungskursen Physik und Mathematik der Gymnasien und Gesamtschulen vermittelt werden und ist zum Gebrauch neben den Vorlesungen gedacht. Besonderer Wert wird auf ausführliche Erklärungen in Textform in Verbindung mit vielen Abbildungen gelegt. Alle Formeln werden Schritt für Schritt hergeleitet. Der Inhalt Potential- und Strömungsfeld des Gleichstroms Potentialgleichungen Verschiebungsdichte Energiedichte Induktionsgesetz Durchflutungsgesetz Magnetisches Vektorpotential Gesetz von Biot-Savart Kontinuitätsgleichung Verschiebungsstrom Erste und zweite Maxwell'sche Gleichung Wellengleichungen Nah- und Fernfeld des Hertz'schen Dipols Feldstärkekomponenten im Zeitbereich – Feldlinien des Hertz'schen Dipols Antennenkennwerte Die Zielgruppen Studierende der Elektrotechnik und Informationstechnologie sowie Studenten der Fachrichtung Physik Der Autor Prof. Dipl.-Ing. Jürgen Donnevert hat auf den Gebieten Übertragungssysteme, Optische Nachrichtentechnik, Richtfunktechnik und Mobilkommunikation gelehrt.

Microwaves. --- Optical engineering. --- Electrical engineering. --- Optics. --- Electrodynamics. --- Microwaves, RF and Optical Engineering. --- Communications Engineering, Networks. --- Classical Electrodynamics.

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Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Electronics. --- Microelectronics. --- Microwaves. --- Optical engineering. --- Electronic circuits. --- Electronics and Microelectronics, Instrumentation. --- Microwaves, RF and Optical Engineering. --- Circuits and Systems.