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Stress: Immunology and Inflammation, Volume Five in the Handbook of Stress series, covers the influence physiologic stress has on immunity, immunology and inflammation. It provides a quick orientation to the subject for research, in clinic use, and in everyday life. Integrated closely with new behavioral findings and with relevance to human conditions, the concepts and data in this volume offer readers cutting-edge information. It will be of prime interest to neuroscientists, clinicians, researchers, academics, and students in Neuroendocrinology, Neuroscience, Biomedicine, Immunology, Endocrinology, Psychology, Psychiatry and some aspects of the Social Sciences. The effect of stress on our emotional and physical health can be devastating. There have been significant advances in our understanding of the influence stress has on inflammation in the human body and also our immunity to various afflictions.

Stress (Physiology) --- Physiological stress --- Tension (Physiology) --- Adaptation (Biology) --- Stress, Physiological --- Inflammation --- immunology --- etiology

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This work focuses on the extension of an already existing particle finite element method (PFEM) solver : PFEM3D. The goal is to extend its reach of applicability in order to model liquid-substrate phenomena, such as the capillary effect, the formation of a contact angle at the contact line, and dissipation due to friction at the liquid-substrate contact, which are predominant effects at small-scale fluid dynamics problems. For this purpose, the PFEM implementation of PFEM3D is compared with a state of the art model : the lacking contributions are identified and added to the computer model. A set of verification tests is then performed to verify if the obtained results are comparable to those provided by the reference source. After extensive validation of the numerical model, a simple implementation for contact angle hysteresis is suggested.

PFEM, --- droplet spreading --- droplet oscillations --- capillary force --- surface tension --- contact angle hysteresis --- Ingénierie, informatique & technologie > Ingénierie civile