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Digital image correlation (DIC) has become the most popular full field measurement technique in experimental mechanics. It is a versatile and inexpensive measurement method that provides a large amount of experimental data. Because DIC takes advantage of a huge variety of image modalities, the technique allows covering a wide range of space and time scales. Stereo extends the scope of DIC to non-planar cases, which are more representative of industrial use cases. With the development of tomography, digital volume correlation now provides access to volumetric data, enabling the study of the inner behavior of materials and structures.However, the use of DIC data to quantitatively validate models or accurately identify a set of constitutive parameters remains challenging. One of the reasons lies in the compromises between measurement resolution and spatial resolution. Second, the question of the boundary conditions is still open. Another reason is that the measured displacements are not directly comparable with usual simulations. Finally, the use of full field data leads to new computational challenges.

n/a --- image classification --- non-contact video gauge --- X-ray microtomography --- initial condition --- accuracy --- digital image correlation technique --- digital volume correlation --- optical coherence elastography --- automated fiber placement (AFP) --- copper plate --- rupture speed --- layered material --- non-liner dynamic deformation --- composite inspection --- automated systems --- finite element method --- strain measurement --- virtual fields method --- digital volumetric speckle photography --- spatiotemporal evolution --- non-contact measurement --- composite materials --- strain --- interior 3D deformation --- high-speed camera --- gradient correlation functions --- spatial sampling rate --- stress intensity factor --- static analysis --- finite element model updating --- fracture process zone --- elevated temperature --- geosciences --- monitoring --- red sandstone --- structural testing --- cross dichroic prism --- arch structures --- traceable calibration --- stress concentration --- fault geometry --- slip velocity --- uniaxial tensile test --- experimental mechanics --- multi-perspective --- image registration --- super pressure balloon --- stress-strain relationship --- error --- measurement --- earthquake rupture --- acoustic emission technique --- composite structures --- 3D deformation --- traction continuity across interfaces --- DIC --- laser speckles --- image shadowing --- dynamic interfacial rupture --- Digital image correlation (DIC) --- strain gage --- inverse method --- digital image correlation --- characterization of composite materials --- automated composite manufacturing --- woven composite beam --- machine learning --- experimental-numerical method --- 3D digital image correlation --- underwater impulsive loading --- image cross-correlation --- interlaminar tensile strength --- large deformation --- single camera --- image correlation

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This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Research & information: general --- Biology, life sciences --- heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- n/a

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Earthquake and Volcano Deformation is the first textbook to present the mechanical models of earthquake and volcanic processes, emphasizing earth-surface deformations that can be compared with observations from Global Positioning System (GPS) receivers, Interferometric Radar (InSAR), and borehole strain- and tiltmeters. Paul Segall provides the physical and mathematical fundamentals for the models used to interpret deformation measurements near active faults and volcanic centers.Segall highlights analytical methods of continuum mechanics applied to problems of active crustal deformation. Topics include elastic dislocation theory in homogeneous and layered half-spaces, crack models of faults and planar intrusions, elastic fields due to pressurized spherical and ellipsoidal magma chambers, time-dependent deformation resulting from faulting in an elastic layer overlying a viscoelastic half-space and related earthquake cycle models, poroelastic effects due to faulting and magma chamber inflation in a fluid-saturated crust, and the effects of gravity on deformation. He also explains changes in the gravitational field due to faulting and magmatic intrusion, effects of irregular surface topography and earth curvature, and modern concepts in rate- and state-dependent fault friction. This textbook presents sample calculations and compares model predictions against field data from seismic and volcanic settings from around the world.Earthquake and Volcano Deformation requires working knowledge of stress and strain, and advanced calculus. It is appropriate for advanced undergraduates and graduate students in geophysics, geology, and engineering. Professors: A supplementary Instructor's Manual is available for this book. It is restricted to teachers using the text in courses. For information on how to obtain a copy, refer to: http://press.princeton.edu/class_use/solutions.html

Rock deformation --- Strains and stresses --- Volcanism. --- Earthquakes. --- Deformations (Mechanics) --- Mathematical models. --- Volcanism --- Earthquakes --- Volcanisme --- Tremblements de terre --- Déformations (Mécanique) --- Mathematical models --- Deformations (Mechanics). --- Rock deformation - Mathematical models. --- Rock deformation -- Mathematical models. --- Strains and stresses - Mathematical models. --- Strains and stresses -- Mathematical models. --- Volcanicity --- Vulcanism --- Stresses and strains --- Elastic solids --- Mechanics --- Rheology --- Structural failures --- Quakes (Earthquakes) --- Earth movements --- Natural disasters --- Seismology --- Geodynamics --- Volcanology --- Architectural engineering --- Engineering, Architectural --- Architecture --- Flexure --- Statics --- Structural analysis (Engineering) --- Elasticity --- Engineering design --- Graphic statics --- Strength of materials --- Stress waves --- Structural design --- Deformation, Rock --- Geology, Structural --- Rock deformation - Mathematical models --- Strains and stresses - Mathematical models --- 1906 San Francisco earthquake. --- 1980 eruption of Mount St. Helens. --- 1989 Loma Prieta earthquake. --- 1992 Landers earthquake. --- 1999 Hector Mine earthquake. --- Active fault. --- Atmospheric refraction. --- Cauchy stress tensor. --- Compressive stress. --- Continental collision. --- Continuum mechanics. --- Crust (geology). --- Deformation (engineering). --- Deformation (mechanics). --- Deformation monitoring. --- Dike (geology). --- Dislocation. --- Displacement field (mechanics). --- Earthquake prediction. --- Earthquake rupture. --- Earthquake swarm. --- Elasticity (physics). --- Explosive eruption. --- Fault (geology). --- Fault friction. --- Figure of the Earth. --- Fracture mechanics. --- Fracture toughness. --- Fracture zone. --- Fracture. --- Friction. --- Geodetic datum. --- Geologic time scale. --- Geothermal gradient. --- Gravitational acceleration. --- Gravitational potential. --- Gravity Recovery and Climate Experiment. --- Hawaiian Volcano Observatory. --- Infinitesimal strain theory. --- Intraplate earthquake. --- Lava dome. --- Lava lake. --- Lava. --- Long Valley Caldera. --- Magma chamber. --- Magnetic anomaly. --- Melting point. --- Mount St. Helens. --- Nucleation. --- Orogeny. --- Oscillation. --- Parkfield earthquake. --- Plane stress. --- Plate tectonics. --- Porosity. --- Pressure gradient. --- Radiation stress. --- Resurgent dome. --- Rift zone. --- Rock (geology). --- Rock mechanics. --- San Andreas Fault. --- Seafloor spreading. --- Seismic gap. --- Seismic hazard. --- Seismic moment. --- Seismic risk. --- Seismic tomography. --- Seismic wave. --- Seismology. --- Shear modulus. --- Shear stress. --- Shear zone. --- Shearing (physics). --- Shield volcano. --- Strain energy. --- Strain rate. --- Stratovolcano. --- Stress concentration. --- Stress functions. --- Stress intensity factor. --- Subduction. --- Subsidence. --- Surface energy. --- Surface gravity. --- Surface stress. --- Tectonophysics. --- Tension (physics). --- Thermal expansion. --- Thrust fault. --- Traction (engineering). --- Transform fault. --- Types of volcanic eruptions. --- Vibration. --- Viscoelasticity. --- Volcanic hazards. --- Volcanic pipe. --- Volcano. --- Wavenumber. --- Yield (engineering).

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Studies on the corrosion and degradation of materials play a decisive role in the novel design and development of corrosion-resistant materials, the selection of materials used in harsh environments in designed lifespans, the invention of corrosion control methods and procedures (e.g., coatings, inhibitors), and the safety assessment and prediction of materials (i.e., modelling). These studies cover a wide range of research fields, including the calculation of thermodynamics, the characterization of microstructures, the investigation of mechanical and corrosion properties, the creation of corrosion coatings or inhibitors, and the establishment of corrosion modelling. This Special Issue is devoted to these types of studies, which facilitate the understanding of the corrosion fundamentals of materials in service, the development of corrosion coatings or methods, improving their durability, and eventually decreasing corrosion loss.

Technology: general issues --- Chemical engineering --- AC-HVAF --- FeB --- HEAs --- coating --- corrosion --- liquid zinc --- cuprous oxide nanochains --- thermal decomposition --- nanofluids --- photo-thermal conversion performance --- molecular dynamics --- binding energy --- crystallization prevention --- flocking for resisting blockage --- drainage pipe --- mechanochemical activation --- coal-gasification slag --- particle characteristics --- cementitious material --- reactivity --- traffic engineering --- damage identification --- deflection influence line --- continuous beam bridge --- multi-span bridges --- structural damage --- anti-blocking of flocking drainage pipe --- drainage pipe blockage by crystals --- mechanism --- mathematical modeling --- tunnel --- soft rock --- strain hardening/softening --- bearing capacity of footing --- numerical solution --- effect of intermediate principal stress --- CoCrFeNiSiMoW --- medium-entropy alloy coatings --- microstructure --- wear --- salt freezing --- erosion --- freeze thaw cycle --- concrete --- durability --- numerical simulation --- high-nitrogen austenitic stainless steel --- friction coefficient --- high temperature --- loess calcareous nodules --- heavy-metal ions --- single adsorption --- adsorption rate --- grey quality gain-loss --- engineering specifications --- process capability --- crystallization and clogging in pipe --- flow velocity --- pipe diameter --- pipe material --- friction stir welding --- aluminum and steel dissimilar metals butt --- high rotational speed --- ultra-high rotational speed --- intermetallic compound --- magnesium alloy --- composite coating --- structural characterization --- mechanical properties --- bioactivity --- antibacterial activity --- biocompatibility --- Feixianguan Formation --- underdetermined system --- curve reconstruction --- circulating neural network --- old well review --- weathered sand --- freeze–thaw cycles --- damage law --- microscopic characteristics --- deterioration mechanism --- flange shaft --- fatigue failure --- fracture mechanics --- stress intensity factor --- crack propagation --- bridge structure --- mode --- frequency --- displacement curve --- Z3CN20.09M --- corrosion fatigue --- fatigue life --- high temperature water --- SnO2-Sb2Ox --- sol-enhanced electrodeposition --- organic degradation --- micro-arc oxidation (MAO) --- SiO2 nanoparticles --- corrosion resistance --- wear property --- magnesium–lithium alloy --- localized corrosion --- corrosion product film --- annular channel angular extrusion --- predeformation --- 2A12 aluminum alloy --- heat treatment --- uniform mechanical properties --- Q345 steel --- hot-dipping aluminum-silicon --- annealing --- FeAl phase --- Al2O3 --- dissimilar metal cladding --- pressure vessel pipe–nozzle --- micro-hardness --- sweet cherry --- edible coating --- quality --- antioxidant enzymatic activities --- stainless steel --- titanium --- crevice corrosion --- multiphysics --- ring narrow groove --- mask electrochemical machining --- numerical simulation of the multiple physical fields --- diffusion barrier --- Cu interconnect --- self-formed --- Cu(Re) alloy --- subgrade engineering --- coarse-grained soil --- step cyclic loading --- dynamic triaxial test --- hysteresis curve --- n/a --- freeze-thaw cycles --- magnesium-lithium alloy --- pressure vessel pipe-nozzle