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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. •Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; •Explains the use of wireless 3D integration to improve 3D IC reliability and yield; •Describes techniques for monitoring and mitigating thermal behavior in 3D ICs; •Includes discussion of 3D integration of high-density power sources and novel NVM.
Engineering. --- Microprocessors. --- Electronic circuits. --- Circuits and Systems. --- Electronic Circuits and Devices. --- Processor Architectures. --- Three-dimensional integrated circuits. --- 3D ICs (Three-dimensional integrated circuits) --- Integrated circuits --- Systems engineering. --- Computer science. --- Informatics --- Science --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Minicomputers --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics
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This book documents some of the most recent advances on the physical layer of the Internet of Things (IoT), including sensors, circuits, and systems. The application area selected for illustrating these advances is that of autonomous, wearable systems for real-time medical diagnosis. The book is unique in that it adopts a holistic view of such systems and includes not only the sensor and processing subsystems, but also the power, communication, and security subsystems. Particular attention is paid to the integration of these IoT subsystems as well as the prototyping platforms needed for achieving such integration. Other unique features include the discussion of energy-harvesting subsystems to achieve full energy autonomy and the consideration of hardware security as a requirement for the integrity of the IoT physical layer. One unifying thread of the various designs considered in this book is that they have all been fabricated and tested in an advanced, low-power CMOS process, namely GLOBALFOUNDRIES 65nm CMOS LPe. In summary, this volume Provides up-to-date information on the architecture, design, implementation and testing of IoT sensors, circuits, and systems; Discusses communication transceivers and protocols for IoT systems dedicated to medical diagnosis; Discusses energy autonomy, power management, and hardware security the IoT physical layer; Enables the design and silicon implementation of systems-on-chip to medical and surveillance applications; Includes coverage of FPGA prototyping platforms for IoT nodes.
Internet of things. --- Systems engineering. --- Electronics. --- Circuits and Systems. --- Signal, Image and Speech Processing. --- Electronics and Microelectronics, Instrumentation. --- Electrical engineering --- Physical sciences --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Electronic circuits. --- Signal processing. --- Image processing. --- Speech processing systems. --- Microelectronics. --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Computational linguistics --- Electronic systems --- Information theory --- Modulation theory --- Oral communication --- Speech --- Telecommunication --- Singing voice synthesizers --- Pictorial data processing --- Picture processing --- Processing, Image --- Imaging systems --- Optical data processing --- Processing, Signal --- Information measurement --- Signal theory (Telecommunication) --- Electron-tube circuits --- Electric circuits --- Electron tubes
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Edge computing. --- Internet of things. --- Signal theory (Telecommunication) --- Electric signal theory --- Electric waves --- Signal detection --- Telecommunication --- Electronic data processing --- IoT (Computer networks) --- Things, Internet of --- Computer networks --- Embedded Internet devices --- Machine-to-machine communications --- Distributed processing
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This book discusses single-channel, device-to-device communication in the Internet of Things (IoT) at the signal encoding level and introduces a new family of encoding techniques that result in significant simplifications of the communication circuitry. These simplifications translate into lower power consumption, smaller form factors, and dynamic data rates that are tolerant to clock discrepancies between transmitter and receiver. Readers will be introduced to signal encoding that uses edge-coded signaling, based on the coding of binary data as counts of transmitted pulses. The authors fully explore the far-reaching implications of these novel signal-encoding techniques and illustrate how their usage can help minimize the need for complex circuitries for either clock and data recovery or duty-cycle correction. They also provide a detailed description of a complete ecosystem of hardware and firmware built around edge-code signaling. The ecosystem comprises an application-specific processor, automatic protocol configuration, power and data rate management, cryptographic primitives, and automatic failure recovery modes. The innovative IoT communication link and its associated ecosystem are fully in line with the standard IoT requirements on power, footprint, security, robustness, and reliability. Introduces a new family of edge-coded signaling techniques for IoT communication; Discusses power management of edge-coded signaling techniques; Demonstrates automatic configuration of transceivers based on edge-coded signaling.
Telecommunication technology --- Electrical engineering --- Mass communications --- Computer. Automation --- tekstverwerking --- algoritmen --- elektrische circuits --- communicatietechnologie
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This book provides readers with an up-to-date account of the use of machine learning frameworks, methodologies, algorithms and techniques in the context of computer-aided design (CAD) for very-large-scale integrated circuits (VLSI). Coverage includes the various machine learning methods used in lithography, physical design, yield prediction, post-silicon performance analysis, reliability and failure analysis, power and thermal analysis, analog design, logic synthesis, verification, and neuromorphic design. Provides up-to-date information on machine learning in VLSI CAD for device modeling, layout verifications, yield prediction, post-silicon validation, and reliability; Discusses the use of machine learning techniques in the context of analog and digital synthesis; Demonstrates how to formulate VLSI CAD objectives as machine learning problems and provides a comprehensive treatment of their efficient solutions; Discusses the tradeoff between the cost of collecting data and prediction accuracy and provides a methodology for using prior data to reduce cost of data collection in the design, testing and validation of both analog and digital VLSI designs. From the Foreword As the semiconductor industry embraces the rising swell of cognitive systems and edge intelligence, this book could serve as a harbinger and example of the osmosis that will exist between our cognitive structures and methods, on the one hand, and the hardware architectures and technologies that will support them, on the other….As we transition from the computing era to the cognitive one, it behooves us to remember the success story of VLSI CAD and to earnestly seek the help of the invisible hand so that our future cognitive systems are used to design more powerful cognitive systems. This book is very much aligned with this on-going transition from computing to cognition, and it is with deep pleasure that I recommend it to all those who are actively engaged in this exciting transformation. Dr. Ruchir Puri, IBM Fellow, IBM Watson CTO & Chief Architect, IBM T. J. Watson Research Center.
Integrated circuits --- Very large scale integration --- Computer-aided design. --- Systems engineering. --- Computer science. --- Logic design. --- Circuits and Systems. --- Processor Architectures. --- Logic Design. --- Design, Logic --- Design of logic systems --- Digital electronics --- Electronic circuit design --- Logic circuits --- Machine theory --- Switching theory --- Informatics --- Science --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Electronic circuits. --- Microprocessors. --- Minicomputers --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics
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Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc.
micromachining --- n/a --- turbulent kinetic energy dissipation rate --- microelectromechanical systems (MEMS) piezoresistive sensor chip --- WiFi-RSSI radio map --- step detection --- built-in self-test --- regularity of activity --- motion analysis --- gait analysis --- frequency --- acceleration --- MEMS accelerometer --- zero-velocity update --- rehabilitation assessment --- vacuum microelectronic --- dance classification --- Kerr noise --- MEMS --- micro machining --- MEMS sensors --- stereo visual-inertial odometry --- self-coaching --- miniaturization --- wavelet packet --- three-axis acceleration sensor --- MEMS-IMU accelerometer --- performance characterization --- electrostatic stiffness --- delaying mechanism --- three-axis accelerometer --- angular-rate sensing --- indoor positioning --- whispering-gallery-mode --- sensitivity --- heat convection --- multi-axis sensing --- L-shaped beam --- stride length estimation --- activity monitoring --- process optimization --- mismatch of parasitic capacitance --- electromechanical delta-sigma --- cathode tips array --- in situ self-testing --- high acceleration sensor --- deep learning --- marine environmental monitoring --- accelerometer --- fault tolerant --- hostile environment --- micro-electro-mechanical systems (MEMS) --- low-temperature co-fired ceramic (LTCC) --- classification of horse gaits --- Taguchi method --- interface ASIC --- capacitive transduction --- digital resonator --- safety and arming system --- inertial sensors --- MEMS technology --- sleep time duration detection --- field emission --- probe --- piezoresistive effect --- capacitive accelerometer --- auto-encoder --- MEMS-IMU --- body sensor network --- optical microresonator --- wireless --- hybrid integrated --- mode splitting
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Electronics --- Electrical engineering --- Applied physical engineering --- Computer. Automation --- beeldverwerking --- spraaktechnologie --- IoT (Internet of Things) --- wearables --- energy harvesting --- elektronica --- ingenieurswetenschappen --- elektrische circuits --- signaalverwerking
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