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Same-sex marriage in the United States: focus on the facts
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ISBN: 0739108824 Year: 2004 Publisher: Lanham Lexington Books


Book
RF and Microwave Microelectronics Packaging
Authors: --- ---
ISBN: 1441909834 9786612837876 1441909842 1282837877 1489983244 Year: 2010 Publisher: New York, NY : Springer US : Imprint: Springer,

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices.


Digital
RF and Microwave Microelectronics Packaging
Authors: --- ---
ISBN: 9781441909848 9781441909855 9781441909831 9781489983244 Year: 2010 Publisher: New York, NY Springer US

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices.

Policy issues affecting lesbian, gay, bisexual, and transgender families
Authors: --- ---
ISBN: 1282644564 9786612644566 0472024892 9780472024896 0472030612 9780472030613 0472904132 Year: 2007 Publisher: Ann Arbor : University of Michigan Press,


Book
LGBT youth in America's schools
Authors: --- ---
ISBN: 1280486848 9786613582072 0472028324 9780472028320 9780472118229 0472118226 9780472031405 0472031406 9781280486845 0472904108 Year: 2012 Publisher: Ann Arbor : The University of Michigan Press,

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Jason Cianciotto and Sean Cahill, experts on lesbian, gay, bisexual, and transgender public policy advocacy, combine an accessible review of social science research with analyses of school practices and local, state, and federal laws that affect LGBT students. In addition, portraits of LGBT youth and their experiences with discrimination at school bring human faces to the issues the authors discuss. This is an essential guide for teachers, school administrators, guidance counselors, and social workers interacting with students on a daily basis; school board members and officials determining school policy; nonprofit advocates and providers of social services to youth; and academic scholars, graduate students, and researchers training the next generation of school administrators and informing future policy and practice.

Keywords

Lesbian students --- Gay students --- Bisexual students --- Transgender youth --- Sexual minorities --- Homosexuality and education --- Gender minorities --- GLBT people --- GLBTQ people --- Lesbigay people --- LBG people --- LGBT people --- LGBTQ people --- Non-heterosexual people --- Non-heterosexuals --- Sexual dissidents --- Minorities --- Youth --- Students --- Education --- Education. --- LGBTQ+ youth --- Sexual and Gender Minorities --- Bisexuals --- GLBT Persons --- GLBTQ Persons --- Gender Minorities --- Homosexuals --- LBG Persons --- LGBT Persons --- LGBTQ Persons --- Lesbians --- Lesbigay Persons --- Men Who Have Sex With Men --- Non-Heterosexual Persons --- Non-Heterosexuals --- Queers --- Sexual Dissidents --- Sexual Minorities --- Women Who Have Sex With Women --- Gays --- Bisexual --- Dissident, Sexual --- Dissidents, Sexual --- GLBT Person --- GLBTQ Person --- Gay --- Gender Minority --- Homosexual --- LBG Person --- LGBT Person --- LGBTQ Person --- Lesbian --- Lesbigay Person --- Minorities, Gender --- Minorities, Sexual --- Minority, Gender --- Minority, Sexual --- Non Heterosexual Persons --- Non Heterosexuals --- Non-Heterosexual --- Non-Heterosexual Person --- Person, GLBT --- Person, GLBTQ --- Person, LBG --- Person, LGBT --- Person, LGBTQ --- Person, Lesbigay --- Person, Non-Heterosexual --- Persons, GLBT --- Persons, GLBTQ --- Persons, LBG --- Persons, LGBT --- Persons, LGBTQ --- Persons, Lesbigay --- Queer --- Sexual Dissident --- Sexual Minority --- Bisexuality --- Homosexuality --- Homosexuality, Male --- Homosexuality, Female


Book
RF and Microwave Microelectronics Packaging
Authors: --- --- ---
ISBN: 9781441909848 9781441909855 9781441909831 9781489983244 Year: 2010 Publisher: Boston MA Springer US

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices.


Dissertation
Euthanasia : problematic of morality and law : a critical study of the contemporary euthanasia movement in Great Britan and the United States

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