Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips.For the fi

Thin film devices --- -Thin films --- Physical vapor deposition --- Deposition, Physical vapor --- PVD (Physical vapor deposition) --- Vapor deposition, Physical --- Vapor-plating --- Films, Thin --- Solid film --- Solid state electronics --- Solids --- Surfaces (Technology) --- Coatings --- Thick films --- Devices, Thin film --- Electronic apparatus and appliances --- Thin films --- Design and construction --- Vapor-plating. --- Thin films. --- Coating, Vacuum --- Deposition, Vapor --- Vacuum coating --- Vacuum metallizing --- Vapor deposition --- Vapor-phase deposition --- Ion plating --- Plating --- Protective coatings --- Refractory materials --- Vacuum technology --- Design and construction.