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Superseded by C37.48-1997 As a supplement to the IEEE guide for application of expulsion fuses in enclosures, guidelines are provided for the application and maintenance of liquid-submerged and in-air expulsion fuses in enclosures. The operation of liquid-submerged fuses is also covered.
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This part of IEC 62271 applies to all overhead, pad mounted, dry vault and submersible single or multi-pole alternating current automatic circuit reclosers and fault interrupters for rated maximum voltages above 1 000 V and up to 38 kV. Devices that require a dependent manual operation are not covered by this standard. In order to simplify this standard where possible, the term recloser/FI (reclosers/FIs) has been substituted for automatic circuit recloser or fault interrupter or both.
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This part of IEC 62271 applies to all overhead, pad mounted, dry vault and submersible single or multi-pole alternating current automatic circuit reclosers and fault interrupters for rated maximum voltages above 1 000 V and up to 38 kV.
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The grounding of dc equipment enclosures installed in dc traction power distribution facilities as well as related insulation treatments required for solid and resistance groundingmethods are covered in this standard. Guidelines are also given for material, installation, andtesting of insulation used in dc traction facilities and further recommended criteria for acceptability are provided. System grounding, though related, is not covered in this document.
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The selection and application of controllers and automation to industrial and commercial power systems is covered by this recommended practice. It is likely to be of greatest value to the power-oriented engineer with limited experience with this equipment. It can also be an aid to all engineers responsible for the electrical design of industrial and commercial power systems.
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Annotation motion control, robotics, mechatronics, machine vision.
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Power Electronics & Drives, Power Conditioning, Renewable Energy, Control System and Applications, Signal Processing, VLSI, Industrial Instrumentation, Communication, Embedded Systems and Computational Intelligence.
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