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This book emphasizes on new applications of electroplating with consideration for environmental aspect and experimental design. Written by experienced expert from various countries, the authors come from academia and electroplating industrial players. Here, a very detailed explanation to the new application of the electroplating is followed by a solution of the environmental issue caused by the electroplating process and concluded by experimental design for optimization of electro deposition processes. Coverage included: - Preparation NiO catalyst on FeCrAl Subtrate Using Various Technique at Higher Oxidation Process - Electrochemical properties of carbon- supported metal nanoparticle prepared by electroplating methods - Fabrication of InGaN-Based Vertical Light Emitting Diodes Using Electroplating - Integration Of Electrografted Layers for the Metallization of Deep Through Silicon Vias - Biomass adsorbent for removal of toxic metal ions from electroplating industry wastewater - Resistant fungal biodiversity of electroplating effluent and their metal tolerance index - Experimental design and response surface analysis as available tools for statistical modeling and optimization of electrodeposition processes
Electroplating. --- Electrodeposition of metals --- Electrochemistry --- Metals --- Plating --- Finishing --- Electrochemistry & magnetochemistry
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Electroplating --- Galvanoplastie --- #KVIV:BB --- Electrodeposition of metals --- Electrochemistry --- Metals --- Plating --- Finishing
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Alloy plating. --- Electroplating. --- Electrodeposition of metals --- Electrochemistry --- Metals --- Plating --- Electrodeposition of alloys --- Electroplating --- Finishing
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The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology.
Electroplating. --- Nanostructures. --- Nanoscience --- Physics --- Electrodeposition of metals --- Electrochemistry --- Metals --- Plating --- Finishing --- Condensed matter physics (liquid state & solid state physics)
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Electroplating --- Metals --- Surface preparation --- Oppervlaktebehandeling. --- Oberflächenbehandlung. --- Zeitschrift. --- Finishing --- Preparation of surfaces --- Electrodeposition of metals --- Coating processes --- Finishes and finishing --- Sealing (Technology) --- Surfaces (Technology) --- Electrochemistry --- Plating
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This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.
Dielectrics. --- Electroplating. --- Tutorials. --- Dielectric materials. --- Lithography. --- Metallization. --- Packaging. --- Electrodeposition of metals --- Electrochemistry --- Metals --- Plating --- Electrical engineering --- Electric insulators and insulation --- Finishing --- Materials
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Electroplating --- Galvanoplastie --- 621.357.7 --- Electroplating. Electrofacing. Plating by electrodeposition --- 621.357.7 Electroplating. Electrofacing. Plating by electrodeposition --- metalen --- Electrodeposition of metals --- Electrochemistry --- Metals --- Plating --- Finishing --- Electroplating.
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Electroplating. --- Thin films. --- Films, Thin --- Solid film --- Solid state electronics --- Solids --- Surfaces (Technology) --- Coatings --- Thick films --- Electrodeposition of metals --- Electrochemistry --- Metals --- Plating --- Finishing
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