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Book
Electroplating
Authors: ---
ISBN: 9535149911 9535104713 Year: 2012 Publisher: IntechOpen

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This book emphasizes on new applications of electroplating with consideration for environmental aspect and experimental design. Written by experienced expert from various countries, the authors come from academia and electroplating industrial players. Here, a very detailed explanation to the new application of the electroplating is followed by a solution of the environmental issue caused by the electroplating process and concluded by experimental design for optimization of electro deposition processes. Coverage included: - Preparation NiO catalyst on FeCrAl Subtrate Using Various Technique at Higher Oxidation Process - Electrochemical properties of carbon- supported metal nanoparticle prepared by electroplating methods - Fabrication of InGaN-Based Vertical Light Emitting Diodes Using Electroplating - Integration Of Electrografted Layers for the Metallization of Deep Through Silicon Vias - Biomass adsorbent for removal of toxic metal ions from electroplating industry wastewater - Resistant fungal biodiversity of electroplating effluent and their metal tolerance index - Experimental design and response surface analysis as available tools for statistical modeling and optimization of electrodeposition processes

Electrodeposition : the materials science of coatings and substrates
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ISBN: 0815513208 Year: 1993 Publisher: Park Ridge Noyes Publications

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Book
Electrodeposition : properties, processes, and applications
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ISBN: 9781614708452 1614708452 9781614708261 1614708266 Year: 2012 Publisher: New York : Nova Science Publishers,

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Book
Electroplating of Nanostructures
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ISBN: 9535157655 9535122134 Year: 2015 Publisher: IntechOpen

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The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology.


Periodical
Surface technology
ISSN: 18781063 Year: 1976 Publisher: Lausanne : Elsevier Sequoia,


Book
Electroplating
Author:
ISBN: 0070388369 Year: 1978 Publisher: New York (N.Y.): MacGraw-Hill

Electroplating engineering handbook
Author:
ISBN: 0442220022 Year: 1984 Publisher: New York (N.Y.): Van Nostrand Reinhold


Multi
Interconnect technology for 32 NM and beyond
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ISBN: 1509089527 1424414474 1424414466 Year: 2008 Publisher: [United States] : IEEE,

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This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.

Modern electroplating
Author:
ISBN: 0471549681 9780471549680 Year: 1974 Publisher: New York (N.Y.) Wiley


Book
Nano-plating (II)
Author:
ISBN: 0128218452 9780128218457 9780128218570 0128218576 Year: 2020 Publisher: Elsevier

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