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This document specifies a scalable interface between mass-storage devices and controlling hard-ware-software. The interface has been optimized for low-latency interconnects, assuming that the proces-sor-controller and the storage device can often be co-located on the same printed-circuit board. The interface can also be used with longer-distance bus-like interconnects, including (but not limited to) IEEE Std 1394-1995 Serial Bus and IEEE Std 1596-1992 Scalable Coherent Interface.
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IEEE Std 1581 defines a low-cost method for testing the interconnection of discrete, complex memory integrated circuits (ICs) where additional pins for testing are not available and implementing boundary scan (IEEE Std 1149.1) is not feasible. This standard describes the implementation rules for the test logic and test mode access/exit methods in compliant ICs. The standard is limited to the behavioral description of the implementation and will not include the technical design for the test logic or test mode control circuitry. Keywords: board test, connectivity test, IEEE 1581, integrated circuit, interconnect test, interconnection test, memory device, test logic, test mode, transparent test mode.
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IEEE C37.95-1989, IEEE Guide for Protective Relaying of Utility-Consumer Interconnections, is intended to cover applications involving service to a consumer that normally requires a transformation between the utility's supply voltage and the consumer's utilization voltage. Interconnections supplied at the ultimate utilization voltage are not covered.
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Annotation IEEE Hot Interconnects is the premier international forum for researchers and developers of state of the art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi core on chip interconnects to those within systems, clusters, and data centers Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.
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The IITC AMC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology.
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IEEE Hot Interconnects is the premier international forum for researchers and developers of state of the art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi core on chip interconnects to those within systems, clusters, and data centers Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field Two days of technical sessions and a day of tutorials are waiting for you, to keep you on the top of the latest developments in industry and academia Our objective is to address the data center networking and the supercomputing communities.
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High speed chip to chip interconnect design Design and analysis of chip package interfaces Power consumption of interconnects 3D interconnect design and prediction Emerging interconnect technologies Applications of interconnects to social, genetic, and biological systems Co optimization of interconnect technology and chip design High speed chip to chip interconnect design Design and analysis of chippackage interfaces Power consumption of interconnects 3D interconnect design and prediction Emerging interconnect technologies Applications of interconnects to social, genetic, and biological systems Co optimization of interconnect technology and chip design.
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Interconnects (Integrated circuit technology) --- Reliability
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Interconnects (Integrated circuit technology) --- Reliability
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A forum of exchange on the latest research and developments on innovative schemes for signal and power integrity, and in the field of interconnect modeling, simulation and measurement at chip, board and package levels.
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