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2020 (6)

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Book
Recent Technical Developments in Energy-Efficient 5G Mobile Cells
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Year: 2020 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

This book addresses the true innovation in engineering design that may be promoted by blending together models and methodologies from different disciplines, and, in this book, the target was exactly to follow this approach to deliver a new disruptive architecture to deliver these next-generation mobile small cell technologies. According to this design philosophy, the work within this book resides in the intersection of engineering paradigms that includes “cooperation”, “network coding”, and “smart energy-aware frontends”. These technologies will not only be considered as individual building blocks, but re-engineered according to an inter-design approach resulting in the enabler for energy efficient femtocell-like services on the move. The book aims to narrow the gap between the current networking technologies and the foreseen requirements that are targeted at the future development of the 5G mobile and wireless communications networks in terms of the higher networking capacity, the ability to support more users, the lower cost per bit, the enhanced energy efficiency, and adaptability to new services and devices (for example, smart cities, and the Internet of things (IoT)).

Keywords

History of engineering & technology --- microstrip --- tuneable filter --- microwave filter --- 5G --- MEMSs --- varactor --- 4G --- CR --- MIMO --- reconfigurable antenna --- switch --- UWB --- WiMAX --- WLAN --- wireless communications --- cooperative NOMA --- multi-points DF relaying nodes --- half-duplex --- full-duplex --- Rayleigh fading channels --- Nakagami-m fading channels --- energy harvesting --- non-orthogonal multiple access --- multiple antenna --- transmit antenna selection --- outage probability --- pattern reconfigurable --- patch antenna --- s-parameters --- frequency reconfigurable --- dual-band Doherty power amplifier --- LTE-advanced --- high-efficiency --- phase offset lines --- impedance inverter network --- phase compensation network --- High power amplifiers --- high efficiency --- Doherty power amplifier --- GaN-HEMT --- small cell --- maximum transmit power --- UE --- open-loop power control --- interference --- ergodic capacity --- non-linear energy harvesting --- NOMA --- monopole antenna --- S-parameters --- 5G, 4/4.5G --- LTE --- ISM --- WiFi --- 5G antenna --- slot antenna --- mobile terminal antenna --- MIMO antenna --- medical applications --- miniaturized antenna --- arc-shaped --- dual-band --- chiral --- Tellegen --- multilayer CPW structure --- dispersion characteristics --- full-GEMT --- Muller’s method --- complex propagation constant --- acceleration procedure --- ISM 2.4 GHz --- isolation --- envelope correlation coefficient (ECC) --- channel capacity loss (CCL) --- 5G technology --- CPW-fed antenna --- diversity antenna --- future smartphones --- MIMO systems --- n/a --- Muller's method


Book
Recent Technical Developments in Energy-Efficient 5G Mobile Cells
Author:
Year: 2020 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

This book addresses the true innovation in engineering design that may be promoted by blending together models and methodologies from different disciplines, and, in this book, the target was exactly to follow this approach to deliver a new disruptive architecture to deliver these next-generation mobile small cell technologies. According to this design philosophy, the work within this book resides in the intersection of engineering paradigms that includes “cooperation”, “network coding”, and “smart energy-aware frontends”. These technologies will not only be considered as individual building blocks, but re-engineered according to an inter-design approach resulting in the enabler for energy efficient femtocell-like services on the move. The book aims to narrow the gap between the current networking technologies and the foreseen requirements that are targeted at the future development of the 5G mobile and wireless communications networks in terms of the higher networking capacity, the ability to support more users, the lower cost per bit, the enhanced energy efficiency, and adaptability to new services and devices (for example, smart cities, and the Internet of things (IoT)).

Keywords

History of engineering & technology --- microstrip --- tuneable filter --- microwave filter --- 5G --- MEMSs --- varactor --- 4G --- CR --- MIMO --- reconfigurable antenna --- switch --- UWB --- WiMAX --- WLAN --- wireless communications --- cooperative NOMA --- multi-points DF relaying nodes --- half-duplex --- full-duplex --- Rayleigh fading channels --- Nakagami-m fading channels --- energy harvesting --- non-orthogonal multiple access --- multiple antenna --- transmit antenna selection --- outage probability --- pattern reconfigurable --- patch antenna --- s-parameters --- frequency reconfigurable --- dual-band Doherty power amplifier --- LTE-advanced --- high-efficiency --- phase offset lines --- impedance inverter network --- phase compensation network --- High power amplifiers --- high efficiency --- Doherty power amplifier --- GaN-HEMT --- small cell --- maximum transmit power --- UE --- open-loop power control --- interference --- ergodic capacity --- non-linear energy harvesting --- NOMA --- monopole antenna --- S-parameters --- 5G, 4/4.5G --- LTE --- ISM --- WiFi --- 5G antenna --- slot antenna --- mobile terminal antenna --- MIMO antenna --- medical applications --- miniaturized antenna --- arc-shaped --- dual-band --- chiral --- Tellegen --- multilayer CPW structure --- dispersion characteristics --- full-GEMT --- Muller’s method --- complex propagation constant --- acceleration procedure --- ISM 2.4 GHz --- isolation --- envelope correlation coefficient (ECC) --- channel capacity loss (CCL) --- 5G technology --- CPW-fed antenna --- diversity antenna --- future smartphones --- MIMO systems --- n/a --- Muller's method


Book
Recent Technical Developments in Energy-Efficient 5G Mobile Cells
Author:
Year: 2020 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

Loading...
Export citation

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Bookmark

Abstract

This book addresses the true innovation in engineering design that may be promoted by blending together models and methodologies from different disciplines, and, in this book, the target was exactly to follow this approach to deliver a new disruptive architecture to deliver these next-generation mobile small cell technologies. According to this design philosophy, the work within this book resides in the intersection of engineering paradigms that includes “cooperation”, “network coding”, and “smart energy-aware frontends”. These technologies will not only be considered as individual building blocks, but re-engineered according to an inter-design approach resulting in the enabler for energy efficient femtocell-like services on the move. The book aims to narrow the gap between the current networking technologies and the foreseen requirements that are targeted at the future development of the 5G mobile and wireless communications networks in terms of the higher networking capacity, the ability to support more users, the lower cost per bit, the enhanced energy efficiency, and adaptability to new services and devices (for example, smart cities, and the Internet of things (IoT)).

Keywords

microstrip --- tuneable filter --- microwave filter --- 5G --- MEMSs --- varactor --- 4G --- CR --- MIMO --- reconfigurable antenna --- switch --- UWB --- WiMAX --- WLAN --- wireless communications --- cooperative NOMA --- multi-points DF relaying nodes --- half-duplex --- full-duplex --- Rayleigh fading channels --- Nakagami-m fading channels --- energy harvesting --- non-orthogonal multiple access --- multiple antenna --- transmit antenna selection --- outage probability --- pattern reconfigurable --- patch antenna --- s-parameters --- frequency reconfigurable --- dual-band Doherty power amplifier --- LTE-advanced --- high-efficiency --- phase offset lines --- impedance inverter network --- phase compensation network --- High power amplifiers --- high efficiency --- Doherty power amplifier --- GaN-HEMT --- small cell --- maximum transmit power --- UE --- open-loop power control --- interference --- ergodic capacity --- non-linear energy harvesting --- NOMA --- monopole antenna --- S-parameters --- 5G, 4/4.5G --- LTE --- ISM --- WiFi --- 5G antenna --- slot antenna --- mobile terminal antenna --- MIMO antenna --- medical applications --- miniaturized antenna --- arc-shaped --- dual-band --- chiral --- Tellegen --- multilayer CPW structure --- dispersion characteristics --- full-GEMT --- Muller’s method --- complex propagation constant --- acceleration procedure --- ISM 2.4 GHz --- isolation --- envelope correlation coefficient (ECC) --- channel capacity loss (CCL) --- 5G technology --- CPW-fed antenna --- diversity antenna --- future smartphones --- MIMO systems --- n/a --- Muller's method


Book
MEMS Packaging Technologies and 3D Integration
Author:
Year: 2022 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Keywords

Research & information: general --- Biology, life sciences --- heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- n/a


Book
Applications of Electromagnetic Waves
Author:
Year: 2020 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

Electromagnetic (EM) waves carry energy through propagation in space. This radiation associates with entangled electric and magnetic fields which must exist simultaneously. Although all EM waves travel at the speed of light in vacuum, they cover a wide range of frequencies called the EM spectrum. The various portions of the EM spectrum are referred to by various names based on their different attributes in the emission, transmission, and absorption of the corresponding waves and also based on their different practical applications. There are no certain boundaries separating these various portions, and the ranges tend to overlap. Overall, the EM spectrum, from the lowest to the highest frequency (longest to shortest wavelength) contains the following waves: radio frequency (RF), microwaves, millimeter waves, terahertz, infrared, visible light, ultraviolet, X-rays, and gamma rays. This Special Issue consists of sixteen papers covering a broad range of topics related to the applications of EM waves, from the design of filters and antennas for wireless communications to biomedical imaging and sensing and beyond.

Keywords

History of engineering & technology --- bonding wire --- S parameters --- electromagnetic simulation --- port embedding --- balanced bandpass filter --- common mode suppression --- spurline --- source–load coupling --- stepped impedance resonator (SIR) --- open-ended waveguide --- slow-wave --- endfire --- radiation --- dispersion --- gain --- energy verification --- Hall probe --- dipole --- movable slit --- Goubau line --- non-invasive blood glucose measurement --- Acu-check --- lancet --- leaky waves --- surface waves --- ultra-wideband --- THz absorber --- high absorption --- polarization independent --- holography --- microwave imaging --- microwave measurement system --- nondestructive testing --- electromagnetic compatibility --- protection of information --- electromagnetic emissions --- computers and information processing --- data acquisition --- image recognition --- pattern recognition --- image processing --- graphic information --- LED array --- laser printer --- compromising emanations --- electromagnetic infiltration --- reconstruction --- non-invasive data acquisition --- Fourier series expansion --- nanorod --- multimode --- propagation characteristics --- guided wave --- bandpass filter --- half-wavelength resonator --- insertion loss --- phantom measurement system --- bone lesion detection --- ground penetrating radar --- reverse time migration --- Tibetan Plateau --- permafrost active layer --- internal structure --- Chebyshev filter --- cavity --- metamaterial --- waveguide --- X-band --- meta-resonator --- machine learning --- material identification --- microwave sensor array --- microwave waveguide --- dipole and horn antennas --- carbon-composite material --- graphene --- antenna measurements --- electromagnetic waves --- n/a --- source-load coupling


Book
MEMS Packaging Technologies and 3D Integration
Author:
Year: 2022 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

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Bookmark

Abstract

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Keywords

Research & information: general --- Biology, life sciences --- heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- n/a


Book
Applications of Electromagnetic Waves
Author:
Year: 2020 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

Loading...
Export citation

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Bookmark

Abstract

Electromagnetic (EM) waves carry energy through propagation in space. This radiation associates with entangled electric and magnetic fields which must exist simultaneously. Although all EM waves travel at the speed of light in vacuum, they cover a wide range of frequencies called the EM spectrum. The various portions of the EM spectrum are referred to by various names based on their different attributes in the emission, transmission, and absorption of the corresponding waves and also based on their different practical applications. There are no certain boundaries separating these various portions, and the ranges tend to overlap. Overall, the EM spectrum, from the lowest to the highest frequency (longest to shortest wavelength) contains the following waves: radio frequency (RF), microwaves, millimeter waves, terahertz, infrared, visible light, ultraviolet, X-rays, and gamma rays. This Special Issue consists of sixteen papers covering a broad range of topics related to the applications of EM waves, from the design of filters and antennas for wireless communications to biomedical imaging and sensing and beyond.

Keywords

History of engineering & technology --- bonding wire --- S parameters --- electromagnetic simulation --- port embedding --- balanced bandpass filter --- common mode suppression --- spurline --- source–load coupling --- stepped impedance resonator (SIR) --- open-ended waveguide --- slow-wave --- endfire --- radiation --- dispersion --- gain --- energy verification --- Hall probe --- dipole --- movable slit --- Goubau line --- non-invasive blood glucose measurement --- Acu-check --- lancet --- leaky waves --- surface waves --- ultra-wideband --- THz absorber --- high absorption --- polarization independent --- holography --- microwave imaging --- microwave measurement system --- nondestructive testing --- electromagnetic compatibility --- protection of information --- electromagnetic emissions --- computers and information processing --- data acquisition --- image recognition --- pattern recognition --- image processing --- graphic information --- LED array --- laser printer --- compromising emanations --- electromagnetic infiltration --- reconstruction --- non-invasive data acquisition --- Fourier series expansion --- nanorod --- multimode --- propagation characteristics --- guided wave --- bandpass filter --- half-wavelength resonator --- insertion loss --- phantom measurement system --- bone lesion detection --- ground penetrating radar --- reverse time migration --- Tibetan Plateau --- permafrost active layer --- internal structure --- Chebyshev filter --- cavity --- metamaterial --- waveguide --- X-band --- meta-resonator --- machine learning --- material identification --- microwave sensor array --- microwave waveguide --- dipole and horn antennas --- carbon-composite material --- graphene --- antenna measurements --- electromagnetic waves --- n/a --- source-load coupling


Book
MEMS Packaging Technologies and 3D Integration
Author:
Year: 2022 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

Loading...
Export citation

Choose an application

Bookmark

Abstract

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Keywords

heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- n/a


Book
Applications of Electromagnetic Waves
Author:
Year: 2020 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

Loading...
Export citation

Choose an application

Bookmark

Abstract

Electromagnetic (EM) waves carry energy through propagation in space. This radiation associates with entangled electric and magnetic fields which must exist simultaneously. Although all EM waves travel at the speed of light in vacuum, they cover a wide range of frequencies called the EM spectrum. The various portions of the EM spectrum are referred to by various names based on their different attributes in the emission, transmission, and absorption of the corresponding waves and also based on their different practical applications. There are no certain boundaries separating these various portions, and the ranges tend to overlap. Overall, the EM spectrum, from the lowest to the highest frequency (longest to shortest wavelength) contains the following waves: radio frequency (RF), microwaves, millimeter waves, terahertz, infrared, visible light, ultraviolet, X-rays, and gamma rays. This Special Issue consists of sixteen papers covering a broad range of topics related to the applications of EM waves, from the design of filters and antennas for wireless communications to biomedical imaging and sensing and beyond.

Keywords

bonding wire --- S parameters --- electromagnetic simulation --- port embedding --- balanced bandpass filter --- common mode suppression --- spurline --- source–load coupling --- stepped impedance resonator (SIR) --- open-ended waveguide --- slow-wave --- endfire --- radiation --- dispersion --- gain --- energy verification --- Hall probe --- dipole --- movable slit --- Goubau line --- non-invasive blood glucose measurement --- Acu-check --- lancet --- leaky waves --- surface waves --- ultra-wideband --- THz absorber --- high absorption --- polarization independent --- holography --- microwave imaging --- microwave measurement system --- nondestructive testing --- electromagnetic compatibility --- protection of information --- electromagnetic emissions --- computers and information processing --- data acquisition --- image recognition --- pattern recognition --- image processing --- graphic information --- LED array --- laser printer --- compromising emanations --- electromagnetic infiltration --- reconstruction --- non-invasive data acquisition --- Fourier series expansion --- nanorod --- multimode --- propagation characteristics --- guided wave --- bandpass filter --- half-wavelength resonator --- insertion loss --- phantom measurement system --- bone lesion detection --- ground penetrating radar --- reverse time migration --- Tibetan Plateau --- permafrost active layer --- internal structure --- Chebyshev filter --- cavity --- metamaterial --- waveguide --- X-band --- meta-resonator --- machine learning --- material identification --- microwave sensor array --- microwave waveguide --- dipole and horn antennas --- carbon-composite material --- graphene --- antenna measurements --- electromagnetic waves --- n/a --- source-load coupling

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